WILSONVILLE, OR -- Mentor Graphics today announced AT&S's embedded component technology has been integrated into Mentor's Expedition Enterprise CAD flow.

AT&S's Embedded Component Package process leverages embedded bare die and discrete passives into the core of a PCB, reducing the package form factor by 30 to 50%. The integration into Mentor's design software speeds printed circuit board development by 40%, Mentor said. The tool also is expected to improve electrical performance, thermal management, miniaturization, cost efficiency and product quality.

AT&S and Mentor engineers also developed a streamlined design workflow for embedding active components into the core of a PCB. A beta test comprising a complex package module with two embedded flip-chip die and, on top of the substrate, a stacked die along with another flip-chip die that  normally required 10 working days for setup, design and output for manufacturing was reduced to six days, the companies said.