| Systems OEMs Changing Chip Design Model |
|
|
| Written by Mike Buetow | |||
| Wednesday, 16 May 2012 13:43 | |||
|
SAN JOSE -- Systems companies are fundamentally changing the way they procure chips, Cadence's senior vice president and chief financial officer asserts. System companies are moving away from a model under which they brought standard, off-the-shelf semiconductor and memory chips and integrated them to create a device, instead preferring to put the onus on the original component manufacturer to create the application, Geoff Ribar says. "Now the system companies are really driving back those designs back into the chip companies and saying, 'Here is what I want in the chip.'" The cost of developing chips have also gone up materially, said Ribar, a former executive at nVidia, AMD and SiRF. "The old model used to be people designed software and people designed hardware ... in parallel and then [tried] to force them together at the back end of the process," Ribar said. "What happens, besides the hardware and software engineers hating each other, is that it didn't work the way it was supposed to over a period of time. And so, what their people are doing more and more is they're trying to emulate that model of the software and hardware in advance."
|
|||
| Last Updated on Wednesday, 16 May 2012 13:52 |
Design News
- Mentor Reports Q1 Revenues Down 8.6%
- Ditta Sues Mentor Over 2006 RSI Deal
- IPC, PCB Libraries Team on Library Tools for Design Standard
- Mentor, Tezzaron Optimize Calibre 3DSTACK for 3D-ICs
- FabStream, ADI Offer Digi-Key Parts Library
- DRAM Market Getting Tight
- Ansys Sets Q1 Revenue Mark
- EI SiP Meets Missile Interceptor Challenge
- Sweden to Host SI Workshops
- Altium Signs Fisher/Unitech as Midwest US VAR
Market News
- Europe to Prime Semi Pump to Tune of $6.5B
- PCB Market Turning Up in Germany
- Semi Equipment B2B Rises for 4th Straight Month
- Phones, TVs Boost Printed and Flexible Electronics Sales
- Medical Electronics Market to Double, Offering Ample Opps for EMS
- IT Market Being Pulled Down by PC Sluggishness
- Tablet Sales Surged in Q1
- Smartphone Shipments Up 38% in Q1
- IPC: March PCB Orders Down 2.3%
- Solid Forecast for Enterprise Network Equipment Spending
Fab News
- US Chemical Laws Headed for Overhaul?
- AT&S to Close Klagenfurt PCB Site
- Camtek’s Q1 Revenue Nearly Flat at $18.1M
- Enthone Parent Sees Pickup in PCB Demand
- SMTA, IPC to Co-locate Fall Events
- LPKF Posts Q1 Revenue Up 60%
- Despite Sequester, Aurora Circuits Reports Q1 Sales Up 12%
- Rogers Restructuring to Cut Annual Spending by $12M
- DoD to Propose Changes to Counterfeit Electronics Procurement Practices
- Cambridge Nanotherm to Build 1st Manufacturing Plant
Products
B-724, B-727, B-728 and B-729 polyimide labels withstand harsh condition wash systems and chemicals. Are engineered to stay adhered to boards during inline and batch washes. Reportedly offer temp. performance up to 500⁰F and excellent resistance...
Features
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.


