| Zuken to Exhibit at Virtual PCB |
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| Written by Mike Buetow | |||
| Friday, 29 January 2010 22:46 | |||
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SMYRNA, GA -- Leading CAD software supplier Zuken today became the latest company to sign on to exhibit at Virtual PCB. Zuken joins Altium, DownStream Technologies, EMA Design Automation and National Instruments among the big-name software companies that will exhibit at the third annual virtual trade show. For more information, visit virtual-pcb.com.
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| Last Updated on Monday, 01 February 2010 20:24 |
Design News
- IEEE Reiterates Globecom Papers Deadline
- Mentor's Q4 Sales Tick Down, Profits Up
- Zuken Announces Electronic and Electrical Design Conferences 2010
- Virtual PCB Now “On Demand”
- Virtual PCB Draws Record 2,500 Registrants
- Mentor Acquires Zeland
- Technical Chats, Webinars Highlight Virtual PCB Today
- Banner Year: Altium Adds 500 US Customers
- Trilogic, EDA Direct and Oasis Sales to Exhibit at VIRTUAL PCB
- Altium Design Data Management Webinar to be Held Feb. 25
Market News
- Orders Rebounding at German Electronics Cos.
- Gartner Raises PC Shipment Outlook
- Gartner Releases IT End-User Predictions for Next 5 Years
- Chile Quake Could Shake Copper Prices
- ISM: Employment in Manufacturing Grows for 3d Consecutive Month
- NA January PWB Orders Up 22% YoY
- Chip Sales to Spike 20% in 2010
- GIPC Lobbies Congress on IP Measures
- Semi B2B Hits Highest Mark in 5 Years
- China's Electronics, IT Profits Up 5.2% in 2009
Fab News
- Advanced Circuits Acquires Circuit Express
- ECHA Targets 8 More Substances for Restriction
- Advance Circuits' Parent Co. Takes Loss
- Camtek Extends Losses Despite Sales Hike
- Luttrull Joins Isola
- GUH Holdings Reports Q4 Comeback
- Kingboard Chemical Reports 2009 Profit Up 40%
- K &F Signs on for Virtual PCB
- iNEMI Calls for Standardized Methodology to Quantify Product Carbon Footprint
- Dow Increases Epoxy Prices in Asia Pacific
Products
Automatic Lamination Techologies Debuts VA 7124 HP6 Vacuum Applicator
VA 7124 HP6 is for applying dry-film solder mask, copper foil, photoimageable cover layers and selective plating. Features stainless steel construction, suitable for clean rooms; dynamic and static slap down cycles; and multilingual operator interface. Lamination pressure is adjustable from 1 to 6 Kg/ cm² (14 to 85.3 PSI). Maximum lamination temp. is 180°C (356°F).Automatic Lamination Techologies, www.dynachem.eu
VA 7124 HP6 is for applying dry-film solder mask, copper foil, photoimageable cover layers and selective plating. Features stainless steel construction, suitable for clean rooms; dynamic and static slap down cycles; and multilingual operator interface. Lamination pressure is adjustable from 1 to 6 Kg/ cm² (14 to 85.3 PSI). Maximum lamination temp. is 180°C (356°F).Automatic Lamination Techologies, www.dynachem.eu
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Printing Screens Revisited
Research continues on improving printed frontside silver conductor line efficiency.A simple Internet search will reveal the photovoltaic industry is working hard on higher aspect ratio frontside conductor grids as a route to greater solar cell efficiencies. This is because the conductors, typically screen-printed on a cell’s frontside, block sunlight from reaching the energy converting strata below, and the narrower they are, the less shadow they cast. However, as it is essential they...
Research continues on improving printed frontside silver conductor line efficiency.A simple Internet search will reveal the photovoltaic industry is working hard on higher aspect ratio frontside conductor grids as a route to greater solar cell efficiencies. This is because the conductors, typically screen-printed on a cell’s frontside, block sunlight from reaching the energy converting strata below, and the narrower they are, the less shadow they cast. However, as it is essential they...
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