Altium Adds York to University Partners List Print E-mail
Written by Mike Buetow   
Friday, 22 January 2010 15:12
SYDNEY — Altium announced a new agreement to supply Altium Designer to York University's School of Engineering for its space engineering and computer engineering undergraduate programs.

Altium Designer will be used by students in a broad group of engineering classes to expand their skills in circuit design, analysis and test. Real-life applications will include schematic generation and simulation of complicated circuits, analysis of Altium reference designs in a lab setting, and a fourth-year capstone project in which students design their own custom printed circuit board.

"We are very excited to offer our students the ability to use Altium Designer," said Hugh Chesser, York University Associate Lecturer of Space Engineering in a press release. "I believe the integration of the different tools is the future trend for ECAD design and so am eager to update our curriculum to include it."

"Altium is continuing to win over academic engineering programs with its easy-to-use, unified electronics design solution that lets engineers and students move to a 'soft design' methodology as part of a much broader, holistic design perspective and approach," said Gerry Gaffney, Altium's Regional CEO for the Americas.

Altium also counts Massachusetts Institute of Technology, University of Toronto, Wisconsin University, Aachen University and Tokyo Institute of Technology among the more than 900 universities that employ Altium software.


blog comments powered by Disqus
 

Products

Sensor Products Introduces Tactilus Heat-Sink Analysis System
Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Features

EMS’ Rude Awakening
Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....

Current Issue

June 2010 cover

Parts


Find and quote components




Powered by


Terms Of Use

Printed Circuit Design & Fab Magazine on Facebook