| NI Names AMD CTO to Head R&D |
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| Written by Chelsey Drysdale | |||
| Thursday, 17 December 2009 17:16 | |||
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AUSTIN – National Instruments appointed Phil Hester to senior vice president of R&D. Throughout his 30-year career, Hester has held engineering and management positions, most recently as senior vice president and chief technology officer at Advanced Micro Devices. Hester will provide guidance to the firm’s 1,500-person global hardware and software development team. National Instruments designs, prototypes and deploys systems for measurement, automation and embedded applications.
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| Last Updated on Friday, 18 December 2009 20:35 |
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Products
ViewMate line of Gerber viewer and editors now comes with Smart DFM technology, which reads the PCB design, verifies layout and prepares data for manufacture. Performs dozens of DfM checks and fixes CAM issues. Allows user to edit or ignore issues. Is Windows-based.Pentalogix, www.pentalogix.com
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Research continues on improving printed frontside silver conductor line efficiency.A simple Internet search will reveal the photovoltaic industry is working hard on higher aspect ratio frontside conductor grids as a route to greater solar cell efficiencies. This is because the conductors, typically screen-printed on a cell’s frontside, block sunlight from reaching the energy converting strata below, and the narrower they are, the less shadow they cast. However, as it is essential they...
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