| NI Names AMD CTO to Head R&D |
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| Written by Chelsey Drysdale | |||
| Thursday, 17 December 2009 17:16 | |||
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AUSTIN – National Instruments appointed Phil Hester to senior vice president of R&D. Throughout his 30-year career, Hester has held engineering and management positions, most recently as senior vice president and chief technology officer at Advanced Micro Devices. Hester will provide guidance to the firm’s 1,500-person global hardware and software development team. National Instruments designs, prototypes and deploys systems for measurement, automation and embedded applications.
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| Last Updated on Friday, 18 December 2009 20:35 |
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Tactilus heat-sink analysis system enables test and correction of surface contact and pressure distribution between the heat sink and its source. Can visualize actual contact forces and pressure distribution data on the components. As mounting screws between the CPU and the heat sink are torqued, it maps and measures the changing pressure distribution between the mating surfaces and displays it. Can be tested, manipulated, and repositioned in real-time. Provides pressure data needed for FEA simulation predictions. Is 0.015" thick; can be placed between the CPU and heat sink without affecting...
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Can high-mix, low-volume production succeed in China? You bet. In the 1970s, if you set up a contract manufacturing shop in a good location, customers eventually would walk through the doors. In the real world, things quickly changed for American companies, as OEMs, driven by maximizing shareholder value, searched for cheaper sources offshore. The first options were Hong Kong, Malaysia and Singapore. After prices increased in these countries, greener pastures were found in China....
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