| Premier Farnell Offering $30K in Electronics Scholarships |
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| Wednesday, 08 July 2009 09:14 | |||
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LONDON -- Electronics distributor Premier Farnell is accepting scholarship applications from students worldwide who are registered in a full-time electrical and electronics engineering course in the 2009 entry year. The $30,000 in scholarship funds come from prize money that remained after a student division winner was not named for the 2008 Live EDGE Electronic Design Global Environment challenge. The scholarship awards will be evenly distributed between Asia, Europe and the Americas, allotting $10,000 for each region or four $2,500 individual scholarships per region. Scholarship information, including the application form and terms and conditions, are available on the element14 website. Applications will be accepted through Aug. 31 and winners will be announced Oct. 1. Applicants will be required to answer one of three questions. They can explain the importance of their electrical engineering degree in today and tomorrow’s society and how they plan in using it to better the environment. Alternatively, they can either explain how they feel electronics design will change in the coming years or what new technology will have the biggest impact on electronics in the near future. “Encouraging innovation and forward thinking among engineering students is paramount to the development and sustainability of future generations of design engineers,” said Harriet Green, chief executive of Premier Farnell. “The Live EDGE scholarship fund will help to encourage and develop 12 students enabling them to continue or start their education for the year to come. We are excited that through these scholarships we are able to support students as they strive to become leaders in critical environmental design practices.” Premier Farnell is the parent company of Farnell, Newark, Premier Electronics, Farnell-Newark CPC and MCM.
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Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
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