| PCB West Registration Open |
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| Tuesday, 16 June 2009 12:50 | |||
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SMYRNA, GA-- Registration is now open for the PCB West technical conference and trade show. The premier conference and exhibition for the PCB supply chain, including engineers, designers, fabricators, assemblers and managers, PCB West 2009 will be held September 14 - 18 at the Santa Clara (CA) Marriott. Held annually in the Silicon Valley since 1992, PCB West provides show attendees – printed circuit board (PCB) engineers, designers, fabricators, assemblers and managers – with the most targeted conference in the PCB design industry. PCB West 2009 highlights include:
New this year is a technical conference track on electronics assembly sponsored by the Surface Mount Technology Association (SMTA) and a PCB fabrication track from the editors of Printed Circuit Design & Fab. Attendees who register for the conference by August 24, will receive up to a $100 discount on 3-, 4- and 5-day conference packages. Admission is free for the two-day exhibition, Opening Night Reception, FREE Tuesday and FREE Wednesday technical sessions, and other networking events; however, registration and a badge are required. To register or learn more about the show, visit www.pcbwest.com.
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| Last Updated on Tuesday, 16 June 2009 13:51 |
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ANSYS Releases Ansoft Designer 6.0
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
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Component Layout“PCB Design and Assembly for Flip-Chip and Die Size CSP”Author: Vern Solberg; vsolberg123@aol.com.Abstract: This paper outlines the basic elements furnished in the newly released IPC-7094, Design and Assembly Process Implementation for Flip-Chip and Die Size Components, providing a comparison of existing and emerging wafer-level and chip-size package methodologies. The focus is on the effect of PCB design and assembly of bare die or die-size components in an uncased or...
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