| EDA Reports: PCB Design Tools Lead Q2 Revenue Increase Percentages |
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| Friday, 10 October 2008 12:17 | |||
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SAN JOSE, CA–The EDA Consortium (EDAC) has announced second-quarter revenues for the electronic design automation (EDA) industry. Despite an overall decline of 3.7%, Printed Circuit Board and Multi-Chip Module (PCB & MCM) revenue increased 19.3% over 2007 figures to $141.6 million. The four-quarter moving average growth rate showed a 1% decrease. The largest category, Computer Aided Engineering (CAE), created revenue of $524.7 million, a 2.6% decrease over last year’s figures. The four-quarter moving average was positive at 6.8%. Semiconductor Intellectual Property (SIP) revenue totaled $264.9 million, a 1.6% decrease over Q2 2007. Four-quarter moving average growth was down at 0.8%. IC Physical Design & Verification revenue dropped to $317.1 million, a 20.2% decrease from 2007 figures. The four-quarter moving average growth rate declined 2.6%.
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Products
ANSYS Releases Ansoft Designer 6.0
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
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Component Layout“PCB Design and Assembly for Flip-Chip and Die Size CSP”Author: Vern Solberg; vsolberg123@aol.com.Abstract: This paper outlines the basic elements furnished in the newly released IPC-7094, Design and Assembly Process Implementation for Flip-Chip and Die Size Components, providing a comparison of existing and emerging wafer-level and chip-size package methodologies. The focus is on the effect of PCB design and assembly of bare die or die-size components in an uncased or...
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