| Z-Axis To Design New System |
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| Wednesday, 27 August 2008 09:00 | |||
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PHELPS, NY– Z-AXIS recently won a contract to design an electronic controller board for Qualitrol Corporation. The PCB will be used in Qualitrol’s monitoring systems for the electrical utilities industry, specifically in instruments that monitor electrical apparatus in power distribution substations. Z-AXIS’ design for the microprocessor-based programmable controller will be more compact, energy-efficient and cost less than the existing designs. “Z-AXIS impressed us with their flexibility to work on fast-track projects, their knowledge of electronic system design and their reputation for creating high-reliability industrial products,” says Bob Taylor, senior mechanical engineer at Qualitrol.
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ANSYS Releases Ansoft Designer 6.0
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical...
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Component Layout“PCB Design and Assembly for Flip-Chip and Die Size CSP”Author: Vern Solberg; vsolberg123@aol.com.Abstract: This paper outlines the basic elements furnished in the newly released IPC-7094, Design and Assembly Process Implementation for Flip-Chip and Die Size Components, providing a comparison of existing and emerging wafer-level and chip-size package methodologies. The focus is on the effect of PCB design and assembly of bare die or die-size components in an uncased or...
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