DKN Research Releases UTF Connector FTF Series Print E-mail
Written by Mike Buetow   
Wednesday, 18 April 2012 14:42

UTF Connector FTF Series for fine-pitch connections between high-density flexible circuits is said to provide a range of design flexibilities for packaging and termination in portable electronics products. Features micro-sized bump array said to generate a uniform pressure for contact pad array between two facing flex circuits. Connection pitch can be below 0.5mm, and total thickness of the connection less than 1.0mm. Requires no additional devices for attachment.

DKN Research, www.dknresearchllc.com

 

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