Molex Offers NeoScale Mezzanine Interconnect Print E-mail
Written by Chelsey Drysdale   
Wednesday, 11 April 2012 15:57

NeoScale high-speed interconnect reportedly achieves signal integrity at 28+ Gbps data rates. For printed circuit board mezzanine applications in enterprise networking towers and telecommunication hubs and servers. Features triad wafer configuration that isolates each differential pair. Comprises three pins per differential pair: two signal pins and one shielded ground pin. Each triad is a standalone 28 Gbps differential pair with no additional ground pins required. Honeycomb construction routes each triad to minimize crosstalk and route out of the PCB in one or two layers. Tombstone structures located in the connector housing protect the mating interface and flexible contacts. Featuring a density of 82 differential pairs per sq. in., the layout can be customized with high-speed differential pairs, high-speed single-ended traces, low-speed single-ended lines and power contacts. Available with 85 and 100 Ohm impedance and mated stack height range of 12 to 40mm. Design options include 6 to 30 circuit column sizes with 2, 4, 6 and 8 row options available, ranging from 12 to 240 triads in one assembly. Plug assembly features a 2.80mm pitch between differential pairs.

Molex, www.molex.com

 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 


Printed Circuit Design & Fab Magazine on Facebook