SHENZHEN -- Huawei, one of China's largest electronics OEMs, took its cellphone manufacturing group off the market, saying the world financial situation must first be resolved.
"Given the current global market conditions and prevailing economic uncertainty the interests of the company are best served by postponing the sale process," Huawei said in a press release.
Huawei was expected to get up to $2 billion for a majority stake in the division, which was being marketed reportedly to increase the company's transparency to overseas investors. (Huawei's founders have ties to China's military.)
Huawei outsources some handset product to Cal-Comp Electronics and Flextronics. It is unclear how the decision will impact those firms, as Huawei (pronounced "wah-way") supposedly planned to ramp its annual handset production to 50 million units. The company said that it might renew the sales process if the economic problems resolve themselves.
The company's cellphone unit is expected to report net profits of $400 million on revenues of $3.5 billion this year, according to published reports.
Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!
Are you doing the same thing over and over again and expecting a different result?
ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
The latest version contains several advancements, including technology for meshing complex geometry and physical modeling capabilities.
The software quickens product development by accurately simulating dissipation of thermal energy in electronic devices at the component, board or system level. Users can improve design performance, reduce the need for a physical prototype and shorten time to market.
ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.
News 
