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Thick Copper Innerlayers Lower System Temperatures Print E-mail
Written by Margo Lakin   
Thursday, 02 October 2008

GIGABYTE announced that many of its upcoming motherboards will feature Ultra Durable 3. The company claims this is the first technology to use 2 oz. copper layers for the power and ground layers. The results should be creative heat spreading, resulting in lower system temperatures, up to 50 °C in some areas according to GIGABYTE. Increased efficiency, decreased chances of warping and greater headroom for over locking are also claimed. Integrated Japanese capacitors provide 50,000 hours of use.

 

www.GIGABYTE.com



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