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Thermal Interface Caps

Written by Margo Lakin
Tuesday, 02 September 2008
Fujipoly America introduced thermal interface caps that are designed to transfer the heat generated by transistors to nearby heatsinks. The slide-on thermal interface caps are available in multiple lengths and material thicknesses and are molded to fit TO-220 and TO-3P transistors. The caps have a thermal conductivity ranging from 1.2 to 1.7W/mºK and a thermal resistance between 0.42 and 1.35º Cin²/W, depending on which Sarcon material is chosen. www.fujipoly.com

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Mezza-pede Low Profile SMT Connector System

Advanced Interconnections Corporation introduces Mezza-pede, SMT connectors designed for 1 mm-pitch micro board-to-board and flex cable-to-board applications. With a low profile, the screw-machined system is well suited for numerous high reliability applications, such as providing power to tunable lasers.

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