|
Agilent Releases 3D EM Simulation Tool |
|
|
|
Written by Kathy Nargi-Toth
|
|
Tuesday, 19 August 2008 |
|
SANTA CLARA, CA -- Agilent Technologies Inc. has released an integrated design flow solution that includes full 3D EM simulation for RF module design. According to the company, EMDS-for-ADS can help the designer accurately predict the 3D EM interactions of embedded passive components in RF modules.
“The 3D EM simulator allows our RF module designers to replace standalone tools such as HFSS,” said Bob Wong, R&D engineer with Agilent’s Component Test (Network Analyzer) Division. “As a result, we’ve more than doubled our design efficiency because we can interactively co-simulate the circuit and physical 3D effects without leaving the ADS design flow.”
The most common applications for EMDS-for-ADS are RF modules based on LTCC (low temperature co-fired ceramics) and laminates with embedded passive structures. EMDS-for-ADS uses planar RF layout macros to automatically draw RF components such as spiral inductors and meander lines, reducing design time.
|
Comments
You are not authorized to leave comments. Please login first.
News 