SAN JOSE, CA -- Cadence Design Systems, Inc. releases new Allegro PCB tools for HDI designs that includes new objects, an extensive set of new rules for microvias, an enhanced via-transition use model, and changes to the entire PCB design flow to enable a comprehensive constraint-driven HDI design flow.
Design partitioning has been enhanced with new capabilities for partitioning the design horizontally and adding soft boundaries to allow users to work in parallel more efficiently, further shortening the design cycle.
These HDI design upgrades are part of the Cadence SPB 16.2 that also addresses chip package design challenges. According to the company, the SPB 16.2 release improves (SiP) miniaturization, design cycle reduction and DFM-driven design. It incorporates a new power integrity modeling solution. These new capabilities can boost productivity of digital, analog, RF and mixed-signal IC package designers involved in single and multi-die packages/SiPs.
Design teams can expect improvements in the reduction in overall package size through the introduction of rules and constraint-driven automation capabilities that address the design methodology of high-density interconnect (HDI) substrate manufacturing that is a key enabler for miniaturization and increased functional density. Overall design time can be reduced through the enablement of team-based design, where multiple designers can work concurrently on the same design in order to reduce design cycle times and speed time to market.
SPB 16.2 will be demonstrated at the EMA booth at the PCB West in Santa Clara, CA, Sept 14-19.
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Advanced Interconnections Corporation introduces Mezza-pede, SMT connectorsdesigned for 1 mm-pitch micro board-to-board and flex cable-to-board applications. With a low profile, the screw-machined system is well suited for numerous high reliability applications, such as providing power to tunable lasers. The pin and lead frame design is fully surface mountable, and Mezza-pede has a mated height of 4 mm. Features include screw-machined terminals with multi-finger contacts with a per contact current rating of greater than 1 Amp at 80° C. Mezza-pede comes in standard dual row 8- and 14- position models. Other pin counts and optional enhancements are offered. www.advanced.com
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