WILSONVILLE, OR – Mentor Graphics Corp. has announced the publication of a book written by Charles Pfeil, engineering director of Mentor’s Systems Design Division, entitled BGA Breakouts and Routing, Effective Design Methods for Very Large BGA. The book explores the impact of dense ball-grid array (BGA) packages with high pin-count on PCB design, and provides solutions for design challenges.

“As BGA density and pin count continue to increase, the designer’s ability to effectively design with the devices has not kept pace. Fortunately, significant advancements in PCB fabrication technology have enabled further miniaturization in the manufacturing process,” said Pfeil.

The company offers that these improvements, along with new software and methods of design specifically targeted for BGAs, provide improved methods when using these devices.

“BGA Breakouts and Routing is a useful industry resource," said James Patten of Northrop Grumman Space Technology.  "The book explores BGA routing in a logical and straight-forward manner, and provides an orderly methodology while offering valuable insight into designing with these devices."