SEASIDE, OR - Written by Joseph Fjelstad in September 2006, the 3rd Edition of the book Flexible Circuit Technology features new chapters and authors that include: Flex Circuit Design Guide for Static and Dynamic Flexing by Werner Engelmaier of Engelmaier Associates, Process Challenges and System Applications in Flex by Kevin Durocher and William Burdick of GE Research, Flexible Circuit Assembly by Bob Willis of the SMART Group, and Solderless Assembly Processes for Flexible Circuits by Joe Fjelstad, developer of the Occam Process.

Reportedly to help assist in the adoption and implementation of flex circuit interconnection technology, the book and new chapters are available free of charge. PDF versions of both can be downloaded at flexiblecircuittechnology.com.
 

According to the book's sponsors,  the new chapters were written to address needs of both the newcomer and experienced engineer, while introducing new applications of the technology. Topics include new chip packaging and interconnection solutions, emerging printed electronics technologies, RFID and other applications.

The book is published by BR Publishing of Seaside, Oregon.