ENDICOTT, NY – Endicott Interconnect Technologies’ Center for Advanced Microelectronics Manufacturing (CAMM) will collaborate with Binghamton and Cornell Universities - with funding from the United States Display Consortium (USDC) - to pioneer microelectronics manufacturing R&D in a roll-to-roll (R2R) format.

These efforts are intended to produce flexible, rugged, lightweight electronic components and product applications in the military and homeland security, lighting, energy and power generation, displays, and product identification and tracking areas.

During a May 29th visit by New York’s 24th district congressman Michael Arcuri and Binghamton University president Lois DeFleur, James McNamara, president and CEO of EI, outlined measures to remain competitive in business segments that are continually moving offshore.

“R&D is our engine for the creation of new products and intellectual property as well as an important tool for solving today’s manufacturing issues,” he said. “This collaboration between industry and academia has resulted in a truly impressive CAMM facility.”

EI’s CAMM will reportedly provide an opportunity for academic and industrial research groups to test their work for manufacturing applicability without the capital expense typically associated with startup activities.