RESEARCH TRIANGLE PARK, N.C. -- RTI International has developed in new technique that may improve computer performance and significantly change the manufacturing process for electronics by eliminating the need for organic substrates.
The technology places an unpackaged bare die directly onto a large area silicon substrate, bypassing traditional die packaging and subsequent package attachment to an organic based printed circuit board.
According to the developers the technology will allow for a smaller overall system that will deliver higher performance and will have lower power requirements. The initial application for the technology is in the reconfigurable computing market where high performance, low power, and small size are critical.
"We are pleased to see this innovative technology take the next step and enter the commercial marketplace where its potential can be applied in real world settings and products," said RTI International President and CEO Victoria Haynes. "We are optimistic that the work our scientists and engineers have invested in this technology will lead to significant advances in computing technology and innovative circuit board development."
RTI International spun out a separate company to commercialize the technology, Beeco Inc. The spinout raised $5 million in venture capital. The money will be used to develop the company's first product and expand its management team, Beeco CEO John Goehrke said. Beeco has five employees and expects to expand to 11 by the end of the summer.
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Are you doing the same thing over and over again and expecting a different result?
ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
The latest version contains several advancements, including technology for meshing complex geometry and physical modeling capabilities.
The software quickens product development by accurately simulating dissipation of thermal energy in electronic devices at the component, board or system level. Users can improve design performance, reduce the need for a physical prototype and shorten time to market.
ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.
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