Molex Signs Agreement to Acquire Asian FPC Manufacturer
Written by Philip Buonpastore
Friday, 09 May 2008
LISLE, IL - Molex, Inc. has announced that it has signed an agreement to acquire a manufacturer of flexible printed circuitry (FPC) based in Asia.
The company expects this transaction to close in Q4 and to increase company revenue by $30 million next fiscal year.
Martin Slark, CEO, said that the acquisition of this company will enhance Molex’s ability to provide an extended range of integrated subassemblies to different markets. By the end of fiscal year 2008, he anticipates that the company will be making further acquisitions of this type.
Martin goes on to say, "Gains here are coming primarily from higher electronic content and new design winds, especially in the Asia Pacific and Europe regions. Within the markets, the transition from desktop to notebook... is a good long term trend for Molex, because the increased use of small form factor connectors."
Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!
Are you doing the same thing over and over again and expecting a different result?
ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
The latest version contains several advancements, including technology for meshing complex geometry and physical modeling capabilities.
The software quickens product development by accurately simulating dissipation of thermal energy in electronic devices at the component, board or system level. Users can improve design performance, reduce the need for a physical prototype and shorten time to market.
ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.
News 
