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DoD Awards EI $148.6 Million Contract Modification

Written by Philip Buonpastore
Tuesday, 06 May 2008
ENDICOTT, NY — The U.S. Department of Defense has awarded Endicott Interconnect Technologies (EI) a $148.6M contract modification for the continuation of its program to produce card frame assemblies. The program includes organic semiconductor packaging, multi-chip modules, printed circuit boards, functionally-tested circuit board assemblies and engineering services support. This contract modification period runs from May to December, 2008. “This contract modification win is the result of our continued ability to meet the performance, quality and delivery demands of this program as well as key cost targets,” said Eric Hills, director of military and defense programs at EI.

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