The Baker R2R SVP roll-to-roll selective vertical plater is equipped with high speed electrolytic plating cells designed HDI PCB production. The company claims the process uses selective plating and a soft differential etching process that removes only the thin seeded layer, and eliminates the need for a metallic etching mask and the use of conventional metal etching chemistry. The company claims a capability of 30 micron pitch, and that the product is designed to handle FPCs in roll form in a vertical orientation. Features include a electrolytic technology that reportedly minimizes the formation of planar surface copper nodules to increase FPC fabrication yield.

mebaker.com