Home arrow News arrow Design News arrow Nano-Barrier Called the World's Best Protection
Part Search

NEW!
Find and quote components





Powered by


Terms Of Use

Nano-Barrier Called the World's Best Protection Print E-mail
Written by Philip Buonpastore   
Wednesday, 30 April 2008
SINGAPORE – A barrier technology from the Institute of Materials Research and Engineering (IMRE) will reportedly protect sensitive devices like organic light emitting diodes (OLEDs) and solar cells from moisture 1000 times more effectively than other technologies currently available.

Scientists from the IMRE in Singapore have reportedly developed a film that has the highest reported water vapor barrier performance to date, as tested by the Centre for Process Innovation in the UK. The water vapor transmission rate (wvtr) is the rate at which moisture penetrates a barrier.

Nanoparticles used in the barrier film have a dual function, to both seal surface defects and actively react with and retain moisture and oxygen. The institute claims that the material’s properties mean a longer service life for plastic electronics, such as solar cells and flexible displays, that use whose organic materials are easily degraded by water vapor and oxygen.

"The research team is already in talks with solar cells and flexible displays and lighting industry manufacturers who are currently evaluating the barrier films for product qualification," says Dr. Mark Auch, of the IMRE team.

According to the IMRE’s study, the global plastic electronics industry will grow to greater than $23 billion in the next 5 years.
Comments
You are not authorized to leave comments. Please login first.


Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!


Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!


PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds


New Product
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
 
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
 
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
 
www.arieselec.com
Copyright © 2008 - This site contains copyrighted material that cannot be reproduced without permission.
Powered by Webtising