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Atotech Immersion Tin Final Finish |
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Written by Philip Buonpastore
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Tuesday, 29 April 2008 |
Atotech introduces a three-step system is an immersion tin final finish for printed circuit boards. The fully compatible three-step process includes the FerroEtch adhesion promotion process, Stanamask tin soldermask and Stannatech immersion tin ensure optimal performance for any requirement.
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