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Uyemura EVF Micro Via Electroplate |
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Written by Philip Buonpastore
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Tuesday, 29 April 2008 |
Uyemura announces its EVF micro via fill acid copper electroplate used for PCB stacking technologies. The company claims exceptionally stable organic additives that can plate vias from 50 to 200 microns with low surface thickness and minimum “dimple,” and high productivity plating that fills vias at 20 ASF in less than 90 minutes.
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