Printed Circuit Design & Fab - Agilent’s Design System Update 1 Increases EMS Speed

Home

News

IPC Expo Products

Agilent’s Design System Update 1 Increases EMS Speed

You must be registered to access the full content of this site.
To register, click here.

Part Search

Agilent’s Design System Update 1 Increases EMS Speed

Written by Philip Buonpastore
Tuesday, 29 April 2008
Agilent Technologies Inc. has announced a 10x speed increase of its planar 3-D electromagnetic (EM) simulator, part of the Update 1 release of its Advanced Design System (ADS) EDA software platform. The speed improvement reportedly helps RFIC, RF module and high-speed gigabit serial-link designers take advantage of EM simulation for faster, more accurate design and signal integrity verification. "The 10x speed improvement and meshing accuracy makes EM problem-solving possible for even very large and complex designs," said Jan Van-Hese, of the company's R&D division. agilent.com

[ Back ]

Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!

Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!

PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds
DFEC Enterprise, Inc. - PCB Sales Representative Process Engineer - Chemical Shure - Project Engineer, PC Board Development Cisco - PCB Sourcing Commodity Manager Danfoss Drives - PCB Designer

New Product

CSP/BallNest Socket Provides Consistant Test and Burn-In

Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.

It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.

It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.

www.arieselec.com