Home arrow News arrow Design News arrow Flomerics Solves Problem in Tower Mounted Amplifier
Part Search

NEW!
Find and quote components





Powered by


Terms Of Use

Flomerics Solves Problem in Tower Mounted Amplifier Print E-mail
Written by Philip Buonpastore   
Tuesday, 22 April 2008
MARLBORO, MA - Thermacore recently used Flomerics’ Flotherm simulation software to show that the heat from chips used in a tower mounted amplifier did not spread out sufficiently to fully utilize the amplifier heat sink, causing the chips to overheat. Flotherm software was used to discover the problem, allowing design changes to reduce heat sink temperatures to acceptable levels.

Matt Connors, of Thermacore, said that “Accuracy is critical in thermal design because our customers want to know what will and won’t work as quickly as possible, so they can get their product into manufacturing. Since we began using Flotherm, we have been very impressed with its ability to accurately simulate thermal management challenges.”

“Simulation is much more accurate than conventional formula-driven thermal engineering methods and also takes less time, so we can investigate more design alternatives with a very high level of confidence in the accuracy of the results. Connors concluded.
Comments
You are not authorized to leave comments. Please login first.


Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!


Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!


PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds


New Product
Mezza-pede Low Profile SMT Connector System
Advanced Interconnections Corporation introduces Mezza-pede, SMT connectors designed for 1 mm-pitch micro board-to-board and flex cable-to-board applications. With a low profile, the screw-machined system is well suited for numerous high reliability applications, such as providing power to tunable lasers.
 
The pin and lead frame design is fully surface mountable, and Mezza-pede has a mated height of 4 mm. Features include screw-machined terminals with multi-finger contacts with a per contact current rating of greater than 1 Amp at 80° C.
 
Mezza-pede comes in standard dual row 8- and 14- position models. Other pin counts and optional enhancements are offered.
 
www.advanced.com
Copyright © 2008 - This site contains copyrighted material that cannot be reproduced without permission.
Powered by Webtising