Home arrow News arrow Design News arrow IBM's Quarterly Revenue Up 26%
Part Search

NEW!
Find and quote components





Powered by


Terms Of Use

IBM's Quarterly Revenue Up 26% Print E-mail
Written by Philip Buonpastore   
Friday, 18 April 2008

 
ARMONK, NY – IBM’s quarterly earnings have surpassed Wall Street's expectations, jumping 26% and showing continuing strength in a slowing economy.

The company also increased its earnings forecast for the year. In the first quarter, IBM earned $2.32 billion, significantly higher than its earnings of $1.84 billion for the same period in 2007.

Revenue rose 11% to $24.5 billion, or about 3.4% better than the $23.7 billion forecast by analysts; however, company sales were also boosted by currency exchange rates, since the dollar is now lower against other currencies. IBM reported that its earnings would have risen only 4% if not for currency fluctuations.

Even so, this marked the company’s second straight quarter of strong growth. CFO Mark Loughridge said that the company’s sound financial performance reflected a balance between international and U.S. revenue.

IBM also reported improved performance of 6% in U.S. sales, which generates 35% of its revenue. All of IBM's business units showed increased levels of profitability.
Comments
You are not authorized to leave comments. Please login first.


Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!


Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!


PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds


New Product
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
 
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
 
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
 
www.arieselec.com
Copyright © 2008 - This site contains copyrighted material that cannot be reproduced without permission.
Powered by Webtising