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Founder PCB Verifies Solid Via II and VOP Technology |
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Written by Philip Buonpastore
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Thursday, 17 April 2008 |
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FUSHAN, CHINA - The Founder Group’s PCB department has announced that it has succeeded in the trial production of the Solid Via II and Via-On-Pad, verifying the reliability of the blind via filling process, layer-to-layer registration, and post-filling copper re-plating.
The company reports that it will soon begin volume production of the HDI process.
Concurrently, the company plans to expand the production capacity of its HDI plants in its Zhuhai and Hangzhou facilities to increase the percentage of the PCB business segment within the company. The company's PCB manufacturing segment increased 35% in 2007.
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