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Oxford Releases Copper Measurement Gauge with Temp. Compensation

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Oxford Releases Copper Measurement Gauge with Temp. Compensation

Written by Philip Buonpastore

Monday, 07 April 2008

Oxford Instruments has released its new CMI165 Copper Thickness Measurement Gauge featuring temperature compensation. The hand-held device accurately measures hot or cold copper on PCBs, allowing for claimed in-process inspection regardless of the temperature of the Cu surface.

The CMI165 includes Oxford Instruments' proprietary SRP-T1 measurement probe tip and housing for guaranteed repeatability and reliability. The probe tip is fully replaceable without recalibration. The included spare probes render claimed minimal factory down time. The illuminated probe tip allows positioning on copper traces. Thin etched traces are accessible without the need for line width standards.

The gauge can measure foil, laminated, electroless or electrodeposited copper thickness with direct digital readout in mils, microns or copper weight.

www.oxford-instruments.com

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