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Colonial Circuits, Lockheed Martin Win IPC Awards
Written by Philip Buonpastore
Wednesday, 02 April 2008
BANNOCKBURN, IL – The IPC has honored Colonial Circuits, Inc. with the Peter Sarmanian Award, and Lockheed Martin with the Stan Plzak Award, in recognition of their support of IPC in standards development and other IPC activities. The companies were recognized during the IPC Annual Meeting Luncheon, April 1 in Las Vegas.
Colonial Circuits has been an IPC member since 1981 and is a member of IPC’s Executive Market and Technology Forum. For more than 15 years, Colonial Circuits has been host to various IPC design for manufacture workshops (DfM) at its Fredericksburg, Va. Location.
Lockheed Martin is one year away from celebrating its 50th anniversary as an IPC member company, and more than three dozen Lockheed Martin staff provide technical expertise on 110 standards development committees ranging from assembly and design, to boards and supply chain standards.
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CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
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