These projects are designed to assist the industry address common
challenges. The project identified include: Pb-Free Alloy Alternatives,
Pb-Free Early Failure, Boundary Scan Adoption and Solder Paste
Deposition.
“iNEMI’s roadmapping and gap analysis activities
help us identify those technology and infrastructure gaps where it
makes sense for industry to collaboratively develop common solutions,”
said Jim McElroy, CEO of iNEMI. “We focus our efforts on
activities that will lead to accelerated deployment of new
technologies, development of industry infrastructure, dissemination of
efficient business practices and/or stimulation of standards. The
initiatives we are currently organizing address needs identified by
iNEMI roadmaps and, in all cases, represent activities that would not
have as much impact on the supply chain if undertaken by a single
company.”
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Are you doing the same thing over and over again and expecting a different result?
ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
The latest version contains several advancements, including technology for meshing complex geometry and physical modeling capabilities.
The software quickens product development by accurately simulating dissipation of thermal energy in electronic devices at the component, board or system level. Users can improve design performance, reduce the need for a physical prototype and shorten time to market.
ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.
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