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ISOLA Introduces New Low Loss LF Compatible Material Print E-mail
Written by Kathy Nargi-Toth   
Monday, 31 March 2008
CHANDLER, ARIZONA - ISOLA GROUP, S.A.R.L announces the introduction of FR408HR an improved lead-free compatible, low-loss laminate.

According to ISOLA, FR408HR has a thermally and electrically enhanced resin system. The material is designed to meet new designs challenges of high layer counts, heavier copper weights and those that require higher bandwidth. FR408 HR has a Tg of 200ºC, a decomposition temperature of 356ºC. This combination results in a 35% reduction in Z-axis expansion and a 25% improvement in dielectric properties over competitive products in its space.

“Our testing, which involved multiple passes at 260ºC assembly after a prolonged exposure to high humidity and temperature on 5.5 mm thick very high layer count boards, showed no degradation in performance.  We are really pleased with these initial results”, stated Tarun Amla, Vice President and Chief Technology Officer of Isola. The product is currently being manufactured in Chandler Arizona and is under scale up in Isola’s Asian facilities.

ISOLA Group will be showcasing this materials at the IPC Expo / APEX show in Las Vegas this week. See them at Booth # 1077.

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