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Unimicron to Manufacture CoreEZ in Partnership with Endicott Interconnect |
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Written by Kathy Nargi-Toth
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Friday, 28 March 2008 |
ENDICOTT, N.Y. - Endicott Interconnect Technologies, Inc. (EI) has entered into a Sales and Manufacturing Agreement with Unimicron Technology Corp. of Taiwan.
According to the agreement Unimicron will become the high volume manufacturer of CoreEZ organic substrates per EI's sepcifications and requirements. EI will continue to maintain control of the design and technical support for the CoreEZ product line worldwide. Sales of the CoreEZ product will be jointly handled by the two companies.
CoreEZ is one of a number of EI flip chip solutions that include HyperBGA and Hyper SiP. The CoreEZ solution is an organic substrate that provides a dense, thin core, build-up flip chip platform with excellent electrical, reliability and wireability performance in a cost effective material set. It is used primarily in high-speed graphics and microprocessor applications.
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