Printed Circuit Design & Fab - Jenaer Leiterplatten Becomes Beta Site for Printar’s GreenJet

Home

News

Design News

Jenaer Leiterplatten Becomes Beta Site for Printar’s GreenJet

You must be registered to access the full content of this site.
To register, click here.

Part Search

Jenaer Leiterplatten Becomes Beta Site for Printar’s GreenJet

Written by Philip Buonpastore
Thursday, 27 March 2008
REHOVOT ISRAEL - Printar Ltd. has installed GreenJet solder mask printing system at Jenaer Leiterplatten GmbH, which will serve as a beta site for Printar’s GreenJet printing system, according to Jenaer Leiterplatten’s Managing Director Sven Nehrdich. "We are excited to be the GreenJet beta site,” said Nehrdich. “We are completely confident that this revolutionary system will cut our overhead [and] enable us to achieve the best results in solder mask formation.” Printar’s CEO Amir Noy said "We value our collaboration with Jenaer Leiterplatten and are confident that with GreenJet, they will [meet] the challenges presented by the new, higher density PCB designs."

[ Back ]

Show (0) - Add comments:

Comments

You are not authorized to leave comments. Please login first.

Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!

Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!

PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds
DFEC Enterprise, Inc. - PCB Sales Representative Process Engineer - Chemical Shure - Project Engineer, PC Board Development Cisco - PCB Sourcing Commodity Manager Danfoss Drives - PCB Designer

New Product

CSP/BallNest Socket Provides Consistant Test and Burn-In

Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.

It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.

It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.

www.arieselec.com