You must be registered to access the full content of this site. To register, click here.
Part Search
PCB West Issues Call for Abstracts - Deadline April 17th
Written by Philip Buonpastore
Wednesday, 26 March 2008
SMYRNA, GA – UP Media Group Inc. (UPMG) is seeking abstracts for PCB West 2008, which will be held September 14 through 19, 2008, in Santa Clara, CA.
The five-day conference, sponsored by Printed Circuit Design & Fab
and Circuits Assembly magazines, focuses on PCB engineering, design and
fabrication, high density interconnect (HDI) and other advanced
circuits. The event is comprised of a 3-Day Technical Conference and a
Professional Development Certificate program, and a two-day exhibition
of industry vendors held on September 16 and 17.
Suggested topics for papers and presentations for the 3-Day Technical Conference include:
30-minute paper sessions
One-hour lectures, presentations or panel sessions
Two-hour workshops or panel sessions
Half-day (3.5 hour) seminars
Professional Development Certificate program papers and presentations
for in-depth courses: one-day tutorials, two-day tutorials (7 and 14
hours of instruction respectively)
For consideration, please submit all abstracts online at:
http://www.pcbwest.com/speakers/abstract.shtml. Or e-mail course
titles, suggested course length, the target audience, short course
abstract(s) and speaker bio(s) to Ronda Faries
(rfaries@upmediagroup.com) by April 17, 2008.
Papers and presentations must be noncommercial in nature and should
focus on technology, techniques or methodology rather than on a
company’s specific products.
Work selected for inclusion in the PCB West 2008 conference proceedings will be
due in May 2008.
Suggested paper and presentation topics include (but are not limited to):
High speed, high frequency and signal integrity
Component placement
EMI/EMC analysis
Thermal analysis
Lead-free processes (especially how they affect design and fabrication)
RF and microwave design
Packaging design
Mixed-signal design
Area arrays
FPGA design and implementation
Embedded passives and active devices
Flexible circuitry
HDI design and technologies
PCB design/layout basics
Component library creation and management
Design for manufacture, test and assembly
Design (including analog, digital and power supplies
PCB fabrication
Soldering
Surface finishes
Industry forecasts
Business and design/supply chain issues
Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!
PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com