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Hirose FH26 Low-Profile ZIF Connectors |
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Written by Philip Buonpastore
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Wednesday, 26 March 2008 |
Hirose has released low-profile flexible printed circuit ZIF connectors, distributed by Digi-Key. The FH26 Series features a 0.3 mm contact pitch and vertical height 1 mm above board profile.
The connectors are said to be lightweight, with a typical 51 contact
connector fully loaded weighing a claimed 0.1 gram, as well as having
solder leads on a 0.6 mm pitch on the front and back of the connector
allowing ease of solderability on a PCB. The company reports that
conductive traces on the PCB can run under the connector with no
exposed contacts.
Reported easy insertion and reliable connection are obtained from the company’s Flip Lock actuator that uses a tactile sensation when closed, confirming the electrical and mechanical connection.
The ZIF connector accepts standard thickness 0.2 mm standard Flexible
PCB. According to the company, typical applications include mobile
phones, PDAs, digital and video cameras, camera modules, LCD
connections, plasma displays, and high-reliability ultra-small profile
connectors.
http://www.hirose-connectors.com
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CSP/BallNest Socket Provides Consistant Test and Burn-In |
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
www.arieselec.com |
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