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Nordson to Show Products for PCB, Manufacturing and Test Industries
Written by Philip Buonpastore
Tuesday, 25 March 2008
LAS VEGAS, - Nordson Corporation will be represented by a wide array of products on display at the IPC Printed Circuits Expo, APEX and the Designers Summit,
April 1-3, 2008 in Las Vegas, the international technical conference
for printed circuit boards, design, electronics manufacturing, and test.
Nordson will be highlighting its products through subsidiary companies
Asymtek (Booth 511), Dage Precision Industries (Booth 1632), EFD (Booth
1470) March Plasma Systems (Booth 1229) and YESTech (Booth 559), all
parts of its Advanced Technology Systems business segment.
“The APEX/IPC show provides us with an opportunity to demonstrate the
full range of Nordson solutions, which are specifically designed to
help our customers work more proficiently and improve their bottom
line," said Andy Dunn, Nordson Senior VP.
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CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
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