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Multi-Fineline Electronix Strong First Quarter
Written by Philip Buonpastore
Monday, 24 March 2008
ANAHEIM, CA - Multi-Fineline Electronix (M-flex) showed strong sales in the first quarter, beating earnings estimates by near 286%.
On Feb 5, the company reported Q1 net income for $13.6 million, as compared to $3.7 million for the first quarter of 2007.
The company produces flexible printed circuits and flexible printed
circuit assemblies for mobile phones, smart mobile devices, portable
bar code scanners, personal digital assistants, computer and storage
devices, and medical technology.
Analysts have increased estimates for both the quarter and the year.
Over the last 60 days, consensus estimates have been raised by more than
double for the quarter, up from 12 to 28 cents a share, and yearly
estimates are up from 67 cents to $1.47 a share.
On March 12, the company named COO Reza Meshgin as its new CEO.
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CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
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