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New Handsets to Use Four-Layer Boards
Written by Philip Buonpastore
Monday, 24 March 2008
TAIWAN - Compact designs coupled with increasing functionality
in the handset industry is driving a trend towards more layers in
high-density interconnect (HDI) boards. Two upcoming high-end handsets
will reportedly use a four-layer stack-in structure, according to
industry sources.
Layer density has increased from single- and double-layer boards, and
an increasing percentage of high-end handset products require
three-layer HDI boards. Companies such as Unitech Printed Circuit
Board have seen three-layer HDI boards reach 20% of sales,
according to GM Cheng-Hung Hsu. While these boards are already common
in the industry, two high-end handset vendors have started
manufacturing four-layer HDI boards, with shipments scheduled for
September.
The four-layer boards reportedly sell for a 50% higher price over
three-layer, a significant profit for those who produce them, but Hsu
points out that the current produced three-layer boards are already
capable of meeting design requirements for high-end handsets. Given the
typical design trends towards smaller size and greater functionality
however, it is likely that more manufacturers will follow the lead.
With the move toward higher layer board configurations, Hsu also
speculated about a possible shortage of HDI boards used for handsets,
given the economic slowdown keeping manufacturers conservative on
expansion.
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