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Ormecon's Nanofinish Enters Production
Written by Philip Buonpastore
Monday, 24 March 2008
HAMBURG, GERMANY – Seven months after its introduction, Ormecon has announced the first mass production of PCBs using the company’s “Organic Metal Nanofinish."
In an announcement made by company CEO Dr. Bernhard Wessling at the international Printed Circuit Board
Technology Conference in Shanghai, the company will begin regular production schedule of a small amount of boards at a customer
site on March 26.
According to the announcement, April production will increase to 10,000
square feet per month, with production rising to approximately 100,000
square feet per month by mid-year.
The company has over 55 evaluation projects currently in process, with
over 35 of these in PCB manufacturing. Dr. Wessling expressed that the
degree of response in the market is active and positive.
According to the company, the product is provided as ready-to-use
dispersions, lacquers, paints and blends for various applications in
PCB manufacturing, corrosion protection, antistatic
and conductive surface modification, organic and polymer light emitting
diodes (OLEDs, PLEDs), "plastic electronics" and many other
applications.
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CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
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