You must be registered to access the full content of this site. To register, click here.
Part Search
Memory Market Growth Slowed in 2007
Written by Administrator
Thursday, 20 March 2008
EL SEGUNDO, CA — Surprising fourth-quarter weakness in the
memory chip market took the wind out of the sails of the global semiconductor
market, causing 2007 growth to fall short of expectations, according to
iSuppli Corp.
Global semiconductor market revenue grew 3.3% in
2007, iSuppli says, lower than the firm's 4.1% estimate in November.
For
the quarter, semi revenues fell 0.5%, but were up 2.4% excluding
memory.
Worldwide DRAM revenue fell 19.1% sequentially in the fourth
quarter, below the November estimate of a 4.7% drop. NAND flash revenue declined
3.9%. Overall, memory chip revenue fell 11% sequentially.
“This was a
complete role reversal for memory semiconductors compared to 2006,” said Dale
Ford, senior vice president, market intelligence, for iSuppli. “During the
second half of 2006, memory IC revenues helped to prop up the growth of the
overall semiconductor industry. In 2007, the poor results for memory chips
restrained overall market growth.”
Application-specific standard
products and ASICs enjoyed the strongest performance of all semiconductor
segments in 2007 with growth of 12.9%. Sony and Toshiba were the
key drivers of growth in this segment due to sales of semiconductors for the PS3
game console. Optical semiconductors were up 7.4%, and discretes grew 4.2%.
Overall, microprocessor revenue grew 2.1%.
Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!
PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
News 
