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Rogers to Showcase HF Circuit Materials at IPC 2008

Written by Philip Buonpastore
Wednesday, 19 March 2008
ROGERS, CT - The Rogers Corporation will feature several of its products from its advanced circuit materials line at the 2008 IPC Printed Circuits Expo, APEX and the Designers Summit in Las Vegas at booth 1028, from April 1 to 3. Rogers will showcase its RT/duroid 6202PR as well as its RO4000 series of high-frequency circuit materials and R/flex 8080 liquid photoimageable covercoats. These products are used in a variety of high frequency applications, including advanced packaging, wireless and high speed digital markets.

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