You must be registered to access the full content of this site. To register, click here.
Part Search
Mentor Gifts $20M in EDA Tools to Vietnam University
Written by Philip Buonpastore
Tuesday, 18 March 2008
HO CHI MINH CITY, VIETNAM - Mentor Graphics has signed an agreement with Applied Micro Circuits and the Vietnam National University of Ho Chi Minh City to collaborate on educational courses for two new electronic design laboratories.
As part of the agreement, Mentor's Higher Education Program
(HEP) will donate over $20 million worth of EDA software to
enable students of VNU-HCM to graduate with knowledge of the latest
ASIC design and verification and PCB design and analysis.
“Our collaboration with Mentor Graphics and AMCC will help us expand
our academic programs and facilities to maximize students’ potential
and prepare them fully for the needs of a global economy in the 21st
century,” said Prof. Dr. Nguyen Duc Nghia, VP of Vietnam National
University.
The collaboration “has been an important factor for our decision to
install our new design center in Vietnam,” said Vu Nguyen, President of
AMCC Vietnam. “Vietnam attracted us with its commitment to building a
skilled and educated workforce from which companies like ours can
recruit and cultivate world-class engineers.”
Ian Burgess, development manager for Mentor’s HEP program said that
through the collaboration with AMCC and Vietnam National University,
“We are able to ensure that Vietnam produces graduates proficient in
these state-of-the-art methodologies ready to contribute to the growing
electronics market," said Ian Burgess, development manager for Mentor’s
Higher Education Program.
Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!
PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
News 
