Home arrow News arrow Design News arrow U.S. Enacts Legislation To Assist Manufacturing
Part Search

NEW!
Find and quote components





Powered by


Terms Of Use

U.S. Enacts Legislation To Assist Manufacturing Print E-mail
Written by Philip Buonpastore   
Monday, 17 March 2008
As a part of the Economic Stimulus Act of 2008 that was signed into law on February 13 by President Bush, two provisions provide significant benefit to manufacturing companies.

The new law nearly doubles the amount of deductible Code Sec. 179 expensing for 2008 to $250,000, and increases the threshold for reducing the deduction to $800,000. It applies to property purchased and put into service in the tax year beginning in 2008. This would benefit small businesses that are purchasing equipment.

The Act also provides a temporary bonus depreciation aimed at encouraging business investment. Property must be eligible for the modified accelerated cost recovery system, with a depreciation of 20 years or less, and must be purchased and placed in service during 2008. The new law provides taxpayers a 50% first year bonus depreciation of the adjusted basis of the property.
Comments
You are not authorized to leave comments. Please login first.


Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!


Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!


PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds


New Product
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
 
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
 
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
 
www.arieselec.com
Copyright © 2008 - This site contains copyrighted material that cannot be reproduced without permission.
Powered by Webtising