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Imbera's IMB Technology Embeds Components in Substrate |
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Written by Philip Buonpastore
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Monday, 17 March 2008 |
FINLAND - Imbera Electronics has introduced IMB, or Integrated Module Board technology, which reportedly allows the embedding of active and
passive components inside an organic substrate.
According to the company, embedding components withn the substrate has many benefits, from reducing component area
and compressing module size, to allowing shorter interconnections, which reportedly
minimizes distortion by reducing parasitics.
IMB technology also allows
the embedding of EMI shielding that allows a claimed higher level of
isolation from inductive and capacitive noise, eliminating the need for
an additional surface-mounted shielding around a component.
Imbera was recently awarded The Frost & Sullivan Technology Innovation Award, for R&D that brings significant
contribution to the industry in terms of adoption, change, and
competition.
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