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Grieve Offers No. 930 Cabinet Oven |
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Written by Administrator
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Thursday, 13 March 2008 |
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The Model 930 oven features an electrically heated, 500°F inert atmosphere used for liquid flow solder masking in a nitrogen atmosphere.
Workspace dimensions measure 38" W x 38" D x 38" H. 30 kW heaters are
installed in Incoloy-sheathed tubular heating elements; a 1500 CFM, 1-1/2 HP
recirculating blower provides horizontal airflow. Features 4" insulated
walls, aluminized steel exterior, Type 430 stainless steel interior and an
automatic door switch. Includes a pressure regulator, flow meter, pressure
gauge, inner oven walls closing directly against a 1/2" thick silicone
rubber door seal, air jacket on the inner oven, blower shaft seal, positive
latching door hardware, adjustable offset door hinges, outlet with pressure
relief, and interior seams welded gas-tight. Oven wall penetrations are equipped
with compression fittings.
www.grievecorp.com
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CSP/BallNest Socket Provides Consistant Test and Burn-In |
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com |
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