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IPC Announces Innovation Technology Products |
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Written by Administrator
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Tuesday, 11 March 2008 |
BANNOCKBURN, IL – IPC announced products to be featured in the Innovative Technology Center for emerging interconnect technologies at the IPC Expo / Apex trade show next month.
In the area of PCB fabrication, American Plating Power will show its Reverse Pulse Plating Rectifier AxD G3, and Printar will show GreenJet.
Among the assembly products on display will be BEST Inc.’s EZReball; DEK’s Reel-to-Reel printer; EKRA’s iPAG Integrated Paste and Glue Dispenser; Electronic Control Design’s Megam.o.l.e. 20 thermal profiler; Henkel’s PowerstrateXtreme Dispensable (PSX-D) thermal interface material; Hesse & Knipps’s PiQC Process Integrated Quality Control for thin and heavy wire bonders, and Mydata Automation’s MY500 printer.
In the area of test, Agilent Technologies will show its Powered Vectorless Limited Access Solution for in-circuit test; Phoenix X-ray Systems its Microme x with xact, and Seica its Pilot V8.
The selections were made by a panel of industry experts.
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