Home arrow News arrow Fab News arrow Motorola Market Share Still Falling
Part Search

NEW!
Find and quote components





Powered by


Terms Of Use

Motorola Market Share Still Falling Print E-mail
Written by Philip Buonpastore   
Tuesday, 11 March 2008
SCHAUMBURG, IL - Unless current market trends change quickly, Motorola may soon become the world's fourth-largest mobile phone maker.

Nokia continues to lead the market with about 40% of the market share, and Samsung surpassed Motorola to take the second position last summer. Sony Ericsson has recently released several new phone products, and if Motorola's phone sales continue to decline, the company may end the year behind its rivals.

Stuart Reed, the former mobile phone chief has resigned, a month after CEO Greg Brown took over his duties. Brown has been under pressure from shareholders to break up the company, and in January, Brown and the board put the company’s mobile phone segment up for sale, while contending that the unit is fixable and that he's looking for a new chief in the attempt to turn things around.

Dell computer had been cited as a possible purchaser, but Dell's recent poor earnings report indicate that the company is not in the position for a new acquisition.

Without a new phone product to market, industry reports say Motorola's market share decline will likely continue, and the company did not present any new designs at two recent industry product showcase events.
Comments
You are not authorized to leave comments. Please login first.


Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!


Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!


PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds


New Product
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
 
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
 
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
 
www.arieselec.com
Copyright © 2008 - This site contains copyrighted material that cannot be reproduced without permission.
Powered by Webtising